find similar
≤1h
Response Time
≥100%
On-time dispatch rate

12" Fully Automatic Silicon Wafer Dicing Saw for 300mm Wafer Cutting

No reviews yet
$250,480
1 set
$248,000
2-4 sets
$243,040
≥5 sets
model number

Key attributes

warranty

1 Year

video outgoing-inspection

Provided

Machine Type

Full-automatic Wafer Dicing Machine

Voltage

380 V

Weight (kg)

1800

brand name

Hyrnus

Shipping
Select shipping

Alibaba.com order protection

Secure payments

Every payment you make on Alibaba.com is secured with strict SSL encryption and PCI DSS data protection protocols

Money-back protection

Claim a refund if your order doesn't ship, is missing, or arrives with product issues

1-year warranty

Access to free parts replacement and repair coverage

Payment & financing

Buy now, pay later

Service

Free replacement parts & online technical support
Free replacement parts & online technical support
1-year warranty
1-year warranty

Key attributes

warranty
1 Year
video outgoing-inspection
Provided
Weight (kg)
1800
brand name
Hyrnus
Machine Type
Full-automatic Wafer Dicing Machine
place of origin
China
Voltage
380 V
Product Name
Full-automatic Wafer Dicing Machine
Applicable Wafer Size
8 inch/12 inch
Imported Spindle Speed
10,000 - 60,000 rpm
X-Axis Cutting Stroke
Max 310 mm
X-Axis Cutting Speed
0.1 - 1000 mm/s
Y-Axis Cutting Stroke
Max 310 mm
Y-Axis Cutting Speed
0.1 - 300 mm/s
Z-Axis Max Speed
90 mm/s
Z-Axis Blade Size
Max 58 mm
Z-Axis Repeatability Accuracy
0.001 mm

Packaging and delivery

Selling Units
Single item

Lead time