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Shenzhen Huimin Tong Accessories Co., Ltd.
CN5 yrs
4.8/5(1072)
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≤2h
Response Time
≥93%
On-time dispatch rate
18%
Reorder rate

Main markets: United States, Brazil, Poland, Venezuela, Côte d'Ivoire

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Amaoe Repair BGA Reballing CPU Stencil Steel Tin Mesh for Android MTK MU1/MU2/MU3/MU4/MU5 Repairing Part 0.12mm

5.0(24 reviews)4 sold
$1.75
2-199 pieces
$1.59
200-499 pieces
$1.37
500-999 pieces
$1.19
≥1,000 pieces
Sample price: $1.70
Select now

equipment&tool type

For MTK MU1 CPU
For MTK MU2 CPU
For MTK MU3 CPU
For MTK MU4 CPU
For MTK MU5 CPU

Key attributes

material

Steel

application

Mobile phones

Product NameBGA Reballing Stencil

For Android MTK MU1/MU2/MU3/MU4/MU5 Repairing Part

keyword

For MTK MU1/MU2/MU3/MU4/MU5 CPU Tin Mesh Repair

Application

Phone Repair Reballing Stencil

Thickness

0.12mm

At a glance

  • Steel Tin Mesh: The steel tin mesh ensures precise and consistent solder ball placement, enhancing the reliability of BGA reballing.

  • 0.12mm Thickness: A thickness of 0.12mm provides the necessary precision for fine-pitch BGA reballing, ensuring high-quality repairs.

Shipping

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Key attributes

material
Steel
application
Mobile phones
Product NameBGA Reballing Stencil
For Android MTK MU1/MU2/MU3/MU4/MU5 Repairing Part
keyword
For MTK MU1/MU2/MU3/MU4/MU5 CPU Tin Mesh Repair
Application
Phone Repair Reballing Stencil
Thickness
0.12mm
Used for iphone
Support

Packaging and delivery

Selling Units
Single item
Single package size
10X10X5 cm
Single gross weight
0.02 kg

Lead time

Customization options

Have any needs please contact with us(+ from /Min. order: 100 pieces)
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Product descriptions from the supplier

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