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BOM IC In Stock AGID019R18A1E1VB 1805 BBGA Exposed Pad Embedded Buy Electronics Components Online

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Attributes

AGID019R18A1E1VBModel Number
StandardMounting Type
ChinaPlace of Origin
OriginalBrand Name
Ic Electronic Component Chip Integrated CircuitFunctional Application
1805 BBGA Exposed PadPackaging
Series:Embedded
Describe:IC FPGA AGILEX I 1805BGA
Architecture:MPU, FPGA
Core Processor:Quad ARM Cortex A53 MPCore with CoreSight, ARM NEON, Floating point
Flash Size:-
RAM Size:256KB
Peripherals:DMA, WDT
Speed:1.4GHz
Primary Attributes:FPGA 1.9M Logic Elements

Key attributes

Model Number
AGID019R18A1E1VB
Mounting Type
Standard
Place of Origin
China
Brand Name
Original
Functional Application
Ic Electronic Component Chip Integrated Circuit
Packaging
1805 BBGA Exposed Pad
Series
Embedded
Describe
IC FPGA AGILEX I 1805BGA
Architecture
MPU, FPGA
Core Processor
Quad ARM Cortex A53 MPCore with CoreSight, ARM NEON, Floating point
Flash Size
-
RAM Size
256KB
Peripherals
DMA, WDT
Speed
1.4GHz
Primary Attributes
FPGA 1.9M Logic Elements

Packaging and delivery

Selling Units
Single item
Single package size
1X1X1 cm
Single gross weight
0.100 kg

Lead time

Product descriptions from the supplier

3 - 3002 pieces
$16,62959
>= 3003 pieces
$8,31480

Variations

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