4.6/5(15)
Store rating
≤3h
Response Time
≥89%
On-time dispatch rate
31%
Reorder rate

Main markets: Hong Kong SAR China, Kazakhstan, Taiwan China, Canada, United States

BOM IC In Stock Electronic Chips Component RP605Z334A-E2-F Power Management (PMIC) 20 XFBGA, WLCSP

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$1.31
1-4,999 pieces
$0.66
≥5,000 pieces

Specification

RP605Z334A E2 F

Key attributes

Model Number

RP605Z334A-E2-F

Mounting Type

Surface Mount

Place of Origin

China

Brand Name

Original

Functional Application

Power Management Specialized

Packaging

20 XFBGA, WLCSP

Shipping

Shipping fee and delivery date to be negotiated. Chat with supplier now for more details.

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Key attributes

Model Number
RP605Z334A-E2-F
Mounting Type
Surface Mount
Place of Origin
China
Brand Name
Original
Functional Application
Power Management Specialized
Packaging
20 XFBGA, WLCSP
Series
Power Management (PMIC)
Describe
300MA ULTRA LOW POWER BUCK BOOST

Packaging and delivery

Selling Units
Single item
Single package size
1X1X1 cm
Single gross weight
0.1 kg

Lead time

Product descriptions from the supplier