Shenzhen Elsky Technology Co., Ltd. logo
Shenzhen Elsky Technology Co., Ltd.
Shenzhen, CN15 yrsCustom Manufacturer
#2 most popular in Mini PCs
Supplier for Fortune 500
4.8/5(349)
Store rating
≤2h
Response Time
≥94%
On-time dispatch rate
26%
Reorder rate
Minor customization
Drawing-based customization

Main markets: South Korea, India, Saudi Arabia, Mexico, United States

ELSKY Android Motherboard with CPU Rockchip RK3399 Dual Cortex-A72 Quad Cortex-A53 Onboard 2GB/4GB RAM 16G/32G SSD EK9900

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certified
$86
1-9 pieces
$84
10-49 pieces
$81
50-99 pieces
$78
≥100 pieces
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model number

EK9900-432(RK3299)
EK9900
Customization options
Customized logo (Min. order: 1 piece)
Customized packaging (Min. order: 2,000 pieces)
Graphic customization (Min. order: 1,000 pieces)
Supplier’s customization ability
Minor customization
Drawing-based customization
Sample-based customization
Full customization

Key attributes

socket type

On-board CPU

application

Desktop

memory type

On-board RAM

chipset

Rockchip RK3288

ports

Wi-Fi, USB 2.0, Display Port, Ethernet, USB 3.0

form factor

146mm*100mm

Shipping

Shipping fee and delivery date to be negotiated. Chat with supplier now for more details.

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Key attributes

socket type
On-board CPU
application
Desktop
memory type
On-board RAM
chipset
Rockchip RK3288
ports
Wi-Fi, USB 2.0, Display Port, Ethernet, USB 3.0
form factor
146mm*100mm
maximum ram capacity
32 GB
memory channel
Single
graphics card type
Integrated Card
memory bank
1 DDR3 DIMM
with cpu
Yes
hard drive interface
Built-in storage
chipset manufacturer
Rockchip
private mold
Yes
products status
New
item condition
New
package
Yes
place of origin
Guangdong, China
brand name
Elsky/OEM/ODM
fsb / ht
dual Cortex-A72+quad Cortex-A53 frequency 1.8GHz
Products Status
Stock
Warranty
1 Years
Running memory
2G/4G optional
Built-in storage
8G/16G optional
Display function
HDMI 2.0 interface;EDP 1.3 pin;LVDS pin
Network features
RJ45 LAN interface;4G/WIFI interface;WiFi_ANT1 interface
Sound function
Integrated ES8336 audio controller
USB function
1*USB3.0 interface;1*USB2.0 interface;2*USB pin;1*J5 USB pin
Other I/O
COM3/4 pin;GPIO pin;TP1 pin;SIM_CARD;BAT1;SD;LED 1/2/3;IR
Operating system
Android 7.1/9.0/10.0/11.0/12.0 system

Packaging and delivery

Packaging Details
Every item is packed with individual Anti-static bubble bag and separated by stiff cardboards in carton boxes. 1Piece/Carton,5Pieces/Carton,10Pieces/Carton
Port of dispatch
shenzhen or hongkong
Selling Units
Single item
Single volume
0 cm³
Single gross weight
0.0 kg
Packaging examples

Supply capacity

Supply Ability
100000 pieces per Month

Lead time

Customization options

Customized logo(+ from /Min. order: 1 piece)
Customized packaging(+ from /Min. order: 2,000 pieces)
Graphic customization(+ from /Min. order: 1,000 pieces)
View details

Product descriptions from the supplier

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Warning/Disclaimer
This product has acquired the relevant product qualification(s)/license(s) of certain applicable country/countries.