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Electronic Chips Component 1369 BFBGA, FCBGA XCVC1702-2MSENSVG1369 Embedded Original

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Attributes

XCVC1702-2MSENSVG1369Model Number
StandardMounting Type
ChinaPlace of Origin
OriginalBrand Name
Ic Electronic Component Chip Integrated CircuitFunctional Application
1369 BFBGA, FCBGAPackaging
Series:Embedded
Describe:IC VERSAL AI CORE FPGA 1369BGA
Architecture:MPU, FPGA
Core Processor:Dual ARM Cortex A72 MPCore with CoreSight
Flash Size:-
RAM Size:256KB
Peripherals:DDR, DMA, PCIe
Speed:600MHz, 1.4GHz
Primary Attributes:Versal AI Core FPGA, 1M Logic Cells
Selling Units:Single item
Single package size:1X1X1 cm
Single gross weight:0.100 kg

Key attributes

Model Number
XCVC1702-2MSENSVG1369
Mounting Type
Standard
Place of Origin
China
Brand Name
Original
Functional Application
Ic Electronic Component Chip Integrated Circuit
Packaging
1369 BFBGA, FCBGA
Series
Embedded
Describe
IC VERSAL AI CORE FPGA 1369BGA
Architecture
MPU, FPGA
Core Processor
Dual ARM Cortex A72 MPCore with CoreSight
Flash Size
-
RAM Size
256KB
Peripherals
DDR, DMA, PCIe
Speed
600MHz, 1.4GHz
Primary Attributes
Versal AI Core FPGA, 1M Logic Cells

Packaging and delivery

Selling Units
Single item
Single package size
1X1X1 cm
Single gross weight
0.100 kg

Lead time

Product descriptions from the supplier

1 - 3000 pieces
$10,525.63
>= 3001 pieces
$5,262.81

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