Electronic Circuit Components 837 BGA FCBGA Manufacturer Channel URX850B1BE MODULE Embedded
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Attributes
System On Chip (SoC)Functional Application
StandardOutput Type
URX850B1BEManufacturer Part Number
Component & PartProduct Completion Type
EmbeddedSeries
StandardMounting Type
Brand Name:Original
Place of Origin:China
Description:MODULE
Application:Ic Electronic Component Chip Integrated Circuit
Features:Kit Electronic Components
Package:Bulk
Product Status:Active
Architecture:MPU
Core Processor:Intel Atom
Flash Size:-
RAM Size:-
Peripherals:SATA, SGMII, USXGMII, XFI
Speed:2GHz
Primary Attributes:-
Key attributes
Functional Application
System On Chip (SoC)
Output Type
Standard
Manufacturer Part Number
URX850B1BE
Product Completion Type
Component & Part
Series
Embedded
Mounting Type
Standard
Application
Ic Electronic Component Chip Integrated Circuit
Features
Kit Electronic Components
Description
MODULE
Brand Name
Original
Place of Origin
China
Package
Bulk
Product Status
Active
Architecture
MPU
Core Processor
Intel Atom
Flash Size
-
RAM Size
-
Peripherals
SATA, SGMII, USXGMII, XFI
Speed
2GHz
Primary Attributes
-
Packaging and delivery
Selling Units
Single item
Single package size
1X1X1 cm
Single gross weight
0.100 kg
Lead time
Product descriptions from the supplier
Warning/Disclaimer
California Proposition 65 Consumer WarningView more
1 - 3,000 pieces
$0.72
>= 3,001 pieces
$0.36
Variations
Select nowSpecification: URX850B1BE
URX850B1BE
Package / Case
837 BGA, FCBGA
Shipping
Shipping fee and delivery date to be negotiated. Chat with supplier now for more details.
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