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On-time dispatch rate
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Main markets: United States, South Korea, Turkey/Türkiye, Italy, India

Embedded MIXED SIGNAL MOBILE EMBEDDED CON 144 LFBGA MEC1609I-PZP BOM IC In Stock Electronic Componente

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$5.23
240-3,239 pieces
$2.62
≥3,240 pieces
Specification

Key attributes

Mounting Type

Surface Mount

Manufacturer Part Number

MEC1609I-PZP

Type

Component & Part

Place of Origin

China

Manufacturer

Original

Mfg Date Code

NEW

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Key attributes

Mounting Type
Surface Mount
Manufacturer Part Number
MEC1609I-PZP
Type
Component & Part
Place of Origin
China
Manufacturer
Original
Mfg Date Code
NEW
Series
Embedded
Description
MIXED SIGNAL MOBILE EMBEDDED CON
Application
Application Specific Microcontrollers
Operating Temperature
-40°C ~ 85°C
Core Processor
ARC-625D
RAM Size
16K x 8
Packaging
Tray
Number of I/O
115
Program Memory Type
FLASH (192kB)
Controller Series
-
Interface
ACPI, BC-Link, I2C/SMBus, LPC, PECI, PS/2, SPI, VLPC
Voltage - Supply
3.3V
Package / Case
144-LFBGA (10x10)
Graphics Acceleration
-
USB
SECURITY ICS / AUTHENTICATION IC
Product Status
Active
Core Processor
ARC 625D
Program Memory Type
FLASH (192kB)
Controller Series
-
RAM Size
16K x 8
Interface
ACPI, BC Link, I2C/SMBus, LPC, PECI, PS/2, SPI, VLPC
Number of I/O
115

Packaging and delivery

Selling Units
Single item
Single package size
1X1X1 cm
Single gross weight
0.1 kg

Lead time

Product descriptions from the supplier

Warning/Disclaimer
California Proposition 65 Consumer Warning