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High Adhesion Acrylic Single Sided Wafer Back-Grinding Tape for Semiconductor Processing NO205-BC 12"-100M (330mm X 100M)

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Key attributes

Material
Polyimide, PET, Acrylic
Type
High Temperature Tape, Insulation Tape, Single Sided Tape, Pressure Sensitive Adhesive
Use
ELECTRONICS, Industrial, Insulation, Sealing, bonding, UV Resistant, Wafer Backside Protection
Feature
No residue, Waterproof, Durable, Heat-resistant, Strong peeling force, High temperature resistance, Freon-Proof, Strong tensile force, Anti UV
Adhesive Type
Pressure Sensitive, acrylic adhesive
Adhesive Side
Single Sided
Adhesive
Acrylic
GLUE
Acrylic Adhesive
Printing Handling
No printing, Die Cuts
Design Printing
No Printing
paper core
Customization
Thickness
Customization
Place of Origin
Taiwan, China
Model Number
Wafer Back-Grinding Tape NO205-BC 12"
Brand Name
GTA

Packaging and delivery

Selling Units
Single item

Lead time

Product descriptions from the supplier

50 - 149 rolls
$350
150 - 249 rolls
$330
>= 250 rolls
$320

Variations

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Shipping

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