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High Adhesion Wafer Back grinding tape for Semiconductor Processing, NO205-BC, 8"-100M (230mm x 100M)

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$340
50-149 rolls
$320
150-249 rolls
$310
≥250 rolls

Length

100 meters
Customization

Size

8"-100M (230mm x 100M)
Customization

Specifications

Sample ( please contact us )

+ 1 more variants

Key attributes

Material

Polyimide, PET, Acrylic

Type

High Temperature Tape, Insulation Tape, Single Sided Tape, Pressure Sensitive Adhesive

Use

ELECTRONICS, Industrial, Insulation, Sealing, bonding, UV Resistant, Wafer Backside Protection

Feature

No residue, Waterproof, Durable, Heat-resistant, Strong peeling force, High temperature resistance, Freon-Proof, Strong tensile force, Anti UV

Adhesive Type

Pressure Sensitive, acrylic adhesive

Adhesive Side

Single Sided

Shipping

Shipping fee and delivery date to be negotiated. Chat with supplier now for more details.

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Key attributes

Material
Polyimide, PET, Acrylic
Type
High Temperature Tape, Insulation Tape, Single Sided Tape, Pressure Sensitive Adhesive
Use
ELECTRONICS, Industrial, Insulation, Sealing, bonding, UV Resistant, Wafer Backside Protection
Feature
No residue, Waterproof, Durable, Heat-resistant, Strong peeling force, High temperature resistance, Freon-Proof, Strong tensile force, Anti UV
Adhesive Type
Pressure Sensitive, acrylic adhesive
Adhesive Side
Single Sided
Adhesive
Acrylic
GLUE
Acrylic Adhesive
Printing Handling
No printing, Die Cuts
Design Printing
No Printing
paper core
Customization
Thickness
Customization
Place of Origin
Taiwan, China
Model Number
Wafer Back-Grinding Tape NO205-BC 8"
Brand Name
GTA

Packaging and delivery

Selling Units
Single item
Single volume
0 cm³
Single gross weight
0.0 kg

Lead time

Product descriptions from the supplier