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High Adhesion Wafer Back Grinding Tape for Semiconductor Processing, UT170-DL, 8"-100M (230mm x 100M)

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Attributes

ELECTRONICS, Industrial, Insulation, Sealing, bonding, UV Resistant, Wafer Backside ProtectionUse
Polyimide, PET, AcrylicMaterial
Pressure Sensitive, acrylic adhesiveAdhesive Type
Single SidedAdhesive Side
High Temperature Tape, Insulation Tape, Single Sided Tape, Pressure Sensitive AdhesiveType
No residue, Waterproof, Durable, Heat-resistant, Strong peeling force, High temperature resistance, Freon-Proof, Strong tensile force, Anti UVFeature
Design Printing:No Printing
Printing Handling:No printing, Die Cuts
paper core:Customization
Adhesive:Acrylic
GLUE:Acrylic Adhesive
Place of Origin:Taiwan, China
Thickness:Customization
Model Number:Wafer Back-Grinding Tape UT170-DL 8"
Brand Name:GTA

Key attributes

Use
ELECTRONICS, Industrial, Insulation, Sealing, bonding, UV Resistant, Wafer Backside Protection
Material
Polyimide, PET, Acrylic
Adhesive Type
Pressure Sensitive, acrylic adhesive
Adhesive Side
Single Sided
Type
High Temperature Tape, Insulation Tape, Single Sided Tape, Pressure Sensitive Adhesive
Feature
No residue, Waterproof, Durable, Heat-resistant, Strong peeling force, High temperature resistance, Freon-Proof, Strong tensile force, Anti UV
Design Printing
No Printing
Printing Handling
No printing, Die Cuts
paper core
Customization
Adhesive
Acrylic
GLUE
Acrylic Adhesive
Place of Origin
Taiwan, China
Thickness
Customization
Model Number
Wafer Back-Grinding Tape UT170-DL 8"
Brand Name
GTA

Packaging and delivery

Selling Units
Single item

Lead time

Product descriptions from the supplier

50 - 149 rolls
$945
150 - 249 rolls
$900
>= 250 rolls
$860

Variations

Select now

Length: 100m

100m
Customization

Size: 8"-100M (230mm x 100M)

8"-100M (230mm x 100M)
Customization

Specifications: Sample ( please contact us )

Sample ( please contact us )

Width

230mm

Shipping

Shipping fee and delivery date to be negotiated. Chat with supplier now for more details.
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