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High Conductivity Silver Paste for Advanced Semiconductor Packaging and Precision Circuit Repair Ink

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$103.93
Minimum order quantity: 1 kilogram
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model number

HTPSP-001
Customization options
Customized packaging (Min. order: 1 kilogram)

Key attributes

place of origin

Maharashtra, India

material

Powder

brand name

TECHINSTRO

capacity

1 Liter

customized support

OEM

size

Other

At a glance

  • High Silver Content: A high silver content of 70% to 80% ensures excellent conductivity and performance in semiconductor packaging and circuit repair.

  • Low Resistivity: With a resistivity of 0.01 to 0.05 ohms/sq, the paste provides efficient electrical conduction, making it ideal for precision applications.

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Key attributes

place of origin
Maharashtra, India
material
Powder
brand name
TECHINSTRO
capacity
1 Liter
customized support
OEM
size
Other
warranty
1 Year
Pigment
Silver ( 70% - 80% )
Binder
Thixotropic Paste
Solvent
Terpine
Viscosity
160 to 200 KCPS
Self life
One year
Weight
N/A
Gram
25, 50, 100, 250
Resistivity
0.01 to 0.05 ohms/sq
Density
10.49 g/cm3 (lit)
Particle size
200 nm (80%) / < 5 nm (20%)
Form
Semi-solid paste (micro-particles)

Packaging and delivery

Selling Units
Single item
Single volume
0 cm³
Single gross weight
0.0 kg

Lead time

Customization options

Customized packaging(+ from /Min. order: 1 kilogram)
View details

Product descriptions from the supplier

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