High Precision 2.20mm Carbide Multi Pin Stamping Tools New Condition for Die Bonding Assembly Leader Range Hitech 3 Months
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Attributes
flip chip bonding machine, molding machine, die bonding machineMachine Type
3 Monthswarranty
Not Availablemachinery test report
Not Availablevideo outgoing-inspection
Malaysiaplace of origin
0.001weight (kg)
brand name:Leader Range Hitech
Material:Carbide (HRC 85)
Packaging:5pc/Bottle
Logistic Mode:Air Freight
Condition:New
Showroom Location:Malaysia
Applicable Industries:Semicon Die Bond Wire Bond Machine Tape,Reel Machine
Marketing Type:Machine Part
Core Components:Single component product
Key attributes
Machine Type
flip chip bonding machine, molding machine, die bonding machine
warranty
3 Months
machinery test report
Not Available
video outgoing-inspection
Not Available
place of origin
Malaysia
weight (kg)
0.001
brand name
Leader Range Hitech
Material
Carbide (HRC 85)
Packaging
5pc/Bottle
Logistic Mode
Air Freight
Condition
New
Showroom Location
Malaysia
Applicable Industries
Semicon Die Bond Wire Bond Machine Tape,Reel Machine
Marketing Type
Machine Part
Core Components
Single component product
Packaging and delivery
Selling Units
Single item
Customization options
Customized Tip Size Optional Colour Coding (Min. order: 10 pieces)
View details
Product descriptions from the supplier
Customizable
Minimum order quantity: 10 pieces
$25-45
Quantity
Customization options
Customized Tip Size Optional Colour Coding (Min. order: 10 pieces)
Shipping
Shipping fee and delivery date to be negotiated. Chat with supplier now for more details.
Item subtotal
$0.00 - $0.00
Shipping total
To be negotiated
Subtotal
$0.00 - $0.00