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High Precision Ultrasonic Gold Wire Bonding Machine for Chip Bonding Wire Ball Welding Machine for Semiconductor Bonding

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$6,186
Minimum order quantity: 1 piece
current
model number

Key attributes

rated capacity

120 A

type

Automatic Solders

voltage

220 V

place of origin

China

condition

New

warranty

1 Year

Shipping
Select shipping

Key attributes

rated capacity
120 A
type
Automatic Solders
voltage
220 V
place of origin
China
condition
New
warranty
1 Year
Product name
Ultrasonic Welding Machines

Packaging and delivery

Selling Units
Single item
Single package size
75X55X62 cm
Single gross weight
35.0 kg

Lead time

Product descriptions from the supplier

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