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Brand Name
Brand new
Manufacturer Part Number
K4ZAF325BM-HC14
Place of Origin
Guangdong, China
Mfg. Date Code
Newest
Part Number
K4ZAF325BM-HC14
Packaging
180FBGA
BGA Package: The BGA package provides a compact and reliable mounting solution, suitable for high-density circuit board designs.
Surface Mount: Surface mount technology allows for efficient and automated assembly, reducing production time and costs.
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