≤3h
Response Time
≥83%
On-time dispatch rate
25%
Reorder rate

In Stock MT29F256G08EBCAGB16A3WC1-R Die Memory Electronic Chips Component

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$0.59
100-3,099 pieces
$0.30
≥3,100 pieces

Specification

MT29F256G08EBCAGB16A3WC1 R

Key attributes

Model Number

MT29F256G08EBCAGB16A3WC1-R

Mounting Type

Surface Mount

Place of Origin

China

Brand Name

Original

Functional Application

Memory

Packaging

Die

Shipping

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Key attributes

Model Number
MT29F256G08EBCAGB16A3WC1-R
Mounting Type
Surface Mount
Place of Origin
China
Brand Name
Original
Functional Application
Memory
Packaging
Die
Series
Memory
Describe
IC FLASH 256GBIT PARALLEL DIE
Memory Organization
32G x 8
Memory Interface
Parallel
Clock Frequency
333 MHz
Access Time
-

Packaging and delivery

Selling Units
Single item
Single package size
1X1X1 cm
Single gross weight
0.1 kg

Lead time

Product descriptions from the supplier