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MAX6856UK31D3+(AEGV) MAX6856UK23D3+(AEGS) MAX805LEPA/LCPA/TCPA MAX792MCSE/LCSE/TESE IC chip integrated circuit

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Attributes

MAX6856UK31D3+(AEGV)Brand Name
MAX6856UK31D3+(AEGV)Model Number
SOP DIP SOT QFP QFN BGAMounting Type
2024Manufacturing Date Code
Taiwan, ChinaPlace of Origin
MAX6856UK31D3+(AEGV)Product Completion Type
Description:MAX6856UK31D3+(AEGV)
Application:MAX6856UK31D3+(AEGV)
Series:MAX6856UK31D3+(AEGV)
Features:MAX6856UK31D3+(AEGV)

Key attributes

Brand Name
MAX6856UK31D3+(AEGV)
Model Number
MAX6856UK31D3+(AEGV)
Mounting Type
SOP DIP SOT QFP QFN BGA
Manufacturing Date Code
2024
Place of Origin
Taiwan, China
Product Completion Type
MAX6856UK31D3+(AEGV)
Description
MAX6856UK31D3+(AEGV)
Application
MAX6856UK31D3+(AEGV)
Series
MAX6856UK31D3+(AEGV)
Features
MAX6856UK31D3+(AEGV)

Packaging and delivery

Selling Units
Single item

Lead time

Product descriptions from the supplier

Warning/Disclaimer
California Proposition 65 Consumer Warning
1 - 99 pieces
$0.50
100 - 999 pieces
$0.40
>= 1000 pieces
$0.30

Variations

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