MB110F_R2_00001 MB10H100HE3_B/P MB10H100HE3_B/I MB115 MB113 MB111 MB110 MB10S MB11F MB11S MB120 IC chip integrated circuit

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Shenzhen Nengliang Technology Co., Ltd.

2 yrs

CN

Attributes

OriginalBrand Name

MB110F_R2_00001Model Number

SOP DIP SOT QFP QFN BGAMounting Type

2024Manufacturing Date Code

Taiwan, China, JapanPlace of Origin

MB110F_R2_00001Product Completion Type

Description:MB110F_R2_00001

Application:MB110F_R2_00001

Series:MB110F_R2_00001

Features:MB110F_R2_00001

Key attributes

Brand Name

Original

Model Number

MB110F_R2_00001

Mounting Type

SOP DIP SOT QFP QFN BGA

Manufacturing Date Code

2024

Place of Origin

Taiwan, China, Japan

Product Completion Type

MB110F_R2_00001

Description

MB110F_R2_00001

Application

MB110F_R2_00001

Series

MB110F_R2_00001

Features

MB110F_R2_00001

Packaging and delivery

Selling Units

Single item

Single package size

10X10X5 cm

Lead time

Product descriptions from the supplier

Warning/Disclaimer

California Proposition 65 Consumer WarningView more

1 - 99 pieces

$0.50

100 - 999 pieces

$0.40

>= 1000 pieces

$0.30

Variations

Shipping

Shipping fee and delivery date to be negotiated. Chat with supplier now for more details.

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