TELNOVA TECHNOLOGY (HONG KONG) CO., LIMITED logo
TELNOVA TECHNOLOGY (HONG KONG) CO., LIMITED
HK1 yr
5/5(4)
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≤3h
Response Time
≥100%
On-time dispatch rate
15%
Reorder rate

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MTFC4GMWDM-3M AIT A Managed NAND Module Microcontrollers and Processors Integrated Circuits Electronic

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$4
100-499 pieces
$3
500-999 pieces
$2
1,000-4,999 pieces
$1
≥5,000 pieces
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Specification

MTFC4GMWDM-3M AIT A

Mfg. Date Code

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Key attributes

Brand Name

TELNOVA

Manufacturer Part Number

MTFC4GMWDM-3M AIT A

Mounting Type

standard

Place of Origin

Guangdong, China

Description

MTFC4GMWDM-3M AIT A

Packaging Type

TFBGA

Shipping

Shipping fee and delivery date to be negotiated. Chat with supplier now for more details.

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Key attributes

Brand Name
TELNOVA
Manufacturer Part Number
MTFC4GMWDM-3M AIT A
Mounting Type
standard
Place of Origin
Guangdong, China
Description
MTFC4GMWDM-3M AIT A
Packaging Type
TFBGA
Application
standard
Type
standard
Package / Case
TFBGA
Series
standard
Features
standard
Cross Reference
standard

Packaging and delivery

Selling Units
Single item
Single volume
0 cm³
Single gross weight
0.0 kg

Lead time

Product descriptions from the supplier

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