Manufacturer Channel Buy Online Electronic Components XC1701LPDG8I 8 DIP Memory
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Attributes
Through HoleMounting Type
Configuration PROMs for FPGAsFunctional Application
XC1701LPDG8IModel Number
ChinaPlace of Origin
OriginalBrand Name
8 DIP (0.300", 7.62mm)Packaging
Series:Memory
Describe:IC PROM SER CONFIG 1M 3.3V 8 DIP
Memory Size:1Mb
Key attributes
Mounting Type
Through Hole
Functional Application
Configuration PROMs for FPGAs
Model Number
XC1701LPDG8I
Place of Origin
China
Brand Name
Original
Packaging
8 DIP (0.300", 7.62mm)
Series
Memory
Describe
IC PROM SER CONFIG 1M 3.3V 8 DIP
Memory Size
1Mb
Packaging and delivery
Selling Units
Single item
Single package size
1X1X1 cm
Single gross weight
0.100 kg
Lead time
Product descriptions from the supplier
100 - 3,099 pieces
$999
≥ 3,100 pieces
$5
Variations
Select nowSpecification
XC1701LPDG8I
Shipping
Shipping fee and delivery date to be negotiated. Chat with supplier now for more details.
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