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Manufacturer Channel XCVC1502-1LSENSVG1369 1369 BFBGA, FCBGA Embedded Electronic Chips Component

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Attributes

NEWManufacturing Date Code
ChinaPlace of Origin
TrayPackaging Type
Electronic Parts And ComponentsApplication
Kit Electronic ComponentsFeatures
StandardOutput Type
Product Status:Active
Architecture:MPU, FPGA
Core Processor:Dual ARM Cortex A72 MPCore with CoreSight
Flash Size:-
RAM Size:-
Peripherals:DDR, DMA, PCIe
Speed:400MHz, 1GHz

Key attributes

Manufacturing Date Code
NEW
Place of Origin
China
Packaging Type
Tray
Application
Electronic Parts And Components
Features
Kit Electronic Components
Output Type
Standard
Product Status
Active
Architecture
MPU, FPGA
Core Processor
Dual ARM Cortex A72 MPCore with CoreSight
Flash Size
-
RAM Size
-
Peripherals
DDR, DMA, PCIe
Speed
400MHz, 1GHz

Packaging and delivery

Selling Units
Single item
Single package size
1X1X1 cm
Single gross weight
0.100 kg

Lead time

Product descriptions from the supplier

Warning/Disclaimer
California Proposition 65 Consumer Warning
1 - 3000 pieces
$8,32053
>= 3001 pieces
$4,16026

Variations

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