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Original Brand New Integrated Chip H56C8H24AIR-S2C GDDR6 BGA 256MX32 GDDR6 IC Chipset Electronic Component

Attributes

StoryBrand Name
H56C8H24AIR-S2CModel Number
SurfaceMountMounting Type
20+Manufacturing Date Code
ChinaPlace of Origin
H56C8H24AIR-S2C GDDR6 SDRAM ICDescription
Packaging Type:FBGA-180
Application:H56C8H24AIR-S2C
Type:IC
Package / Case:H56C8H24AIR-S2C
Series:H56C8H24AIR-S2C
Features:H56C8H24AIR-S2C
Cross Reference:H56C8H24AIR-S2C

Key attributes

Brand Name
Story
Model Number
H56C8H24AIR-S2C
Mounting Type
SurfaceMount
Manufacturing Date Code
20+
Place of Origin
China
Description
H56C8H24AIR-S2C GDDR6 SDRAM IC
Packaging Type
FBGA-180
Application
H56C8H24AIR-S2C
Type
IC
Package / Case
H56C8H24AIR-S2C
Series
H56C8H24AIR-S2C
Features
H56C8H24AIR-S2C
Cross Reference
H56C8H24AIR-S2C

Packaging and delivery

Selling Units
Single item

Lead time

Product descriptions from the supplier

Warning/Disclaimer
California Proposition 65 Consumer Warning
Minimum order quantity: 1 unit
$6

Variations

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