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R7F7017103ABG-C#HC1 233 FBGA Embedded Buy Online Electronic Components Original

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Attributes

R7F7017103ABG-C#HC1Model Number
Surface MountMounting Type
ChinaPlace of Origin
OriginalBrand Name
Electronic Chips ComponentFunctional Application
233 FBGAPackaging
Series:Embedded
Describe:32BIT MCU RH850/F1KH D8
Core Processor:RH850G3KH
Core Size:32 Bit Dual Core
Speed:240MHz
Number of I/O:174
Program Memory Size:6MB (6M x 8)
RAM Size:896K x 8
Data Converters:A/D 38x10b, 32x12b
Selling Units:Single item
Single package size:1X1X1 cm
Single gross weight:0.100 kg

Key attributes

Model Number
R7F7017103ABG-C#HC1
Mounting Type
Surface Mount
Place of Origin
China
Brand Name
Original
Functional Application
Electronic Chips Component
Packaging
233 FBGA
Series
Embedded
Describe
32BIT MCU RH850/F1KH D8
Core Processor
RH850G3KH
Core Size
32 Bit Dual Core
Speed
240MHz
Number of I/O
174
Program Memory Size
6MB (6M x 8)
RAM Size
896K x 8
Data Converters
A/D 38x10b, 32x12b

Packaging and delivery

Selling Units
Single item
Single package size
1X1X1 cm
Single gross weight
0.100 kg

Lead time

Product descriptions from the supplier

1000 - 3999 pieces
$10.73
>= 4000 pieces
$5.36

Variations

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