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Henan Aurelion Precision Technology Co., Ltd. logo
Henan Aurelion Precision Technology Co., Ltd.
Zhengzhou, CN1 yrMultispecialty Supplier
5/5(10)
Store rating
≤2h
Response Time
≥78%
On-time delivery rate
18%
Reorder rate
Minor customization
Drawing-based customization

Main markets: Mexico, Finland, United States, Philippines, Thailand

SDC600 Fine Cutting Ceramic Bond Diamond Disc 60mm for Semiconductor Silicon Wafer Dicing and Separation Process

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Complies with EU standards
$34
2 - 19 pieces
$30
20 - 499 pieces
$28
≥ 500 pieces
Select now

wheel diameter

SDC600 60-0.3-40mm
Custom sizes

rpm

standard

abrasive

Diamond
ÇBN
Supplier’s customization ability
Minor customization
Drawing-based customization
Sample-based customization
Full customization

Key attributes

application

Semiconductor

shape

Flat

hardness

Super-hard

place of origin

Henan, China

Material

Diamond/CBN

Abrasive Grade

From coarse to fine

Shipping

Shipping fee and delivery date to be negotiated. Chat with supplier now for more details.

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Key attributes

Inner Diameter Size
customized
thickness
Customized
Face Width
Customized
grit
60#-600#
application
Semiconductor
hardness
Super-hard
wheel type
Flared Cup Grinding Wheels
shape
Flat
bonding agent
Ceramic
Abrasive Grade
From coarse to fine
Number of segments
2
Construction type
other
width
Customized
Abrasive Material
Diamond/CBN
Material
Diamond/CBN
customized support
OEM, ODM, OBM
warranty
1 years
place of origin
Henan, China
brand name
AURELION
viscosity
customized
size
SDC600 60-0.3-40mm
Application
Semiconductor
Product name
Blade slicer
Material
Diamond
Usage
Wet
Grit
60-1000#
Bond
Ceramic. Vitrified
Type
1A1R
Advantage
Longer Working Life
Package
Carton Package
MOQ
5PCS

Packaging and delivery

Selling Units
Single item

Lead time

Product descriptions from the supplier

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