Semiconductor Silicon Wafer Lapping Machine Best Solution
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Attributes
Double Side Lapping Machinetype
380 Vvoltage
CNCcnc or not
PLCcore components
1 Yearwarranty
Providedmachinery test report
video outgoing-inspection:Provided
power (kw):5.5
place of origin:Guangdong, China
weight (kg):1800
brand name:BW
dimension(l*w*h):1700*1300*2170(mm)
Machining Accuracy:High Precision
Control Method:CNC
Applicable Industries:Grinding Industry
Installation Method:Floor-standing
Grinding wheel speed:3000(rpm)
Key attributes
type
Double Side Lapping Machine
voltage
380 V
cnc or not
CNC
core components
PLC
warranty
1 Year
machinery test report
Provided
video outgoing-inspection
Provided
power (kw)
5.5
place of origin
Guangdong, China
weight (kg)
1800
brand name
BW
dimension(l*w*h)
1700*1300*2170(mm)
Machining Accuracy
High Precision
Control Method
CNC
Applicable Industries
Grinding Industry
Installation Method
Floor-standing
Grinding wheel speed
3000(rpm)
Packaging and delivery
Selling Units
Single item
Lead time
Product descriptions from the supplier
1 - 1 sets
$7,000
>= 2 sets
$6,500
Variations
Select nowmodel number
bw
Shipping
Shipping fee and delivery date to be negotiated. Chat with supplier now for more details.
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