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R R COMPANY logo
R R COMPANY
IN1 yr
≤2h
Response Time

Silicon Wafer Edge Profiling Machine for Semiconductor Clean Room

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$7,000
Minimum order quantity: 1 set
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model number

bw

Key attributes

Voltage

380 V

core components

PLC

application

silicon wafers

warranty

1 Year

key selling points

Automatic

machinery test report

Provided

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Key attributes

Voltage
380 V
core components
PLC
application
silicon wafers
warranty
1 Year
key selling points
Automatic
machinery test report
Provided
video outgoing-inspection
Provided
place of origin
Guangdong, China
power (kw)
2
weight (kg)
350
brand name
BW
External Dimensions
1560x700x940mm
Grinding Disc Size
4 inches
Workpiece Size
3-6 inches
Grinding Wheel Speed
0-4500rpm Adjustable
Wafer Center Positioning Accuracy
≤±0.1mm
Vacuum Chuck Repeatability
≤±0.01mm
Minimum Vacuum Disc Movement Step
<±0.01mm
Grinding Speed
1mm/s-50mm/s
Adhesion Force
Better than -80Kpa
Main Motor Speed
0-90rpm

Packaging and delivery

Selling Units
Single item

Lead time

Product descriptions from the supplier

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