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NELCOM INTERNATIONAL LIMITED logo
NELCOM INTERNATIONAL LIMITED
HK1 yr
4/5(405)
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≤8h
Response Time
≥100%
On-time delivery rate
10%
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Main markets: United States, Indonesia, France, Brazil, Spain

XCVC1502-2MLINSVG1369 Original Electronic Component Suppliers Integrated Circuits IC VERSAL AI-CORE FPGA 1369BGA

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$14,85353
Minimum order quantity: 20 pieces

Quantity

Key attributes

Mounting Type

SMD

Manufacturer Part Number

XCVC1502-2MLINSVG1369

Type

Embedded, Integrated Circuits

Place of Origin

Guangdong, China

Manufacturer

Original

Mfg Date Code

-

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Key attributes

Core Size
32-Bit, 32-Bit Single-Core
EEPROM Size
128K x 8
Mounting Type
SMD
Type
Embedded, Integrated Circuits
Number of I/O
51
Manufacturer Part Number
XCVC1502-2MLINSVG1369
RAM Size
256KB
Description
IC VERSAL AI-CORE FPGA 1369BGA
Place of Origin
Guangdong, China
Manufacturer
Original
Mfg Date Code
-
Series
Integrated Circuits
Application
System On Chip
Operating Temperature
-40°C ~ 110°C (TJ)
Module/Board Type
MPU, FPGA
Core Processor
- Cortex-M3
Co-processor
72MHz
Flash Size
-
Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals
DDR, DMA, PCIe
Program Memory Type
FLASH
Voltage - Supply (vcc/vdd)
2V ~ 3.6V
Data Converters
A/D 16x12b, A/D 16x12b
Oscillator Type
Internal, Internal
Voltage - Supply
2V ~ 3.6V
Package / Case
1369-BFBGA
Voltage - I/o
51
Brand Name
Original Brand
Package
SMD-DIP
Lead time
24 hours
Service
PCBA/PCB/SMT/Bom List

Packaging and delivery

Selling Units
Single item

Lead time

Product descriptions from the supplier

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California Proposition 65 Consumer Warning